Invention Grant
- Patent Title: Nonvolatile semiconductor memory device and manufacturing method thereof
- Patent Title (中): 非易失性半导体存储器件及其制造方法
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Application No.: US12977911Application Date: 2010-12-23
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Publication No.: US08049266B2Publication Date: 2011-11-01
- Inventor: Tamae Takano , Shunpei Yamazaki
- Applicant: Tamae Takano , Shunpei Yamazaki
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2006-101076 20060331
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L21/336

Abstract:
A nonvolatile semiconductor memory device is provided in such a manner that a semiconductor layer is formed over a substrate, a charge accumulating layer is formed over the semiconductor layer with a first insulating layer interposed therebetween, and a gate electrode is provided over the charge accumulating layer with a second insulating layer interposed therebetween. The semiconductor layer includes a channel formation region provided in a region overlapping with the gate electrode, a first impurity region for forming a source region or drain region, which is provided to be adjacent to the channel formation region, and a second impurity region provided to be adjacent to the channel formation region and the first impurity region. A conductivity type of the first impurity region is different from that of the second impurity region.
Public/Granted literature
- US20110095354A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2011-04-28
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