Invention Grant
- Patent Title: Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
- Patent Title (中): 集成电路堆叠封装前体和堆叠的封装器件和系统
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Application No.: US12388976Application Date: 2009-02-19
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Publication No.: US08049320B2Publication Date: 2011-11-01
- Inventor: Peter R. Harper , Kenneth Maggio
- Applicant: Peter R. Harper , Kenneth Maggio
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/34
Abstract:
A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads.
Public/Granted literature
- US20090206455A1 INTEGRATED CIRCUIT STACKED PACKAGE PRECURSORS AND STACKED PACKAGED DEVICES AND SYSTEMS THEREFROM Public/Granted day:2009-08-20
Information query
IPC分类:
