Invention Grant
- Patent Title: Method of detecting faulty via holes in printed circuit boards
- Patent Title (中): 检测印刷电路板故障通孔的方法
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Application No.: US12143632Application Date: 2008-06-20
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Publication No.: US08049511B2Publication Date: 2011-11-01
- Inventor: Li Xiao , I-Hsien Chiang , Chih-Yi Tu
- Applicant: Li Xiao , I-Hsien Chiang , Chih-Yi Tu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tayuan, Taoyuan
- Assignee: FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee: FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tayuan, Taoyuan
- Agency: Altis Law Group, Inc.
- Priority: CN200710075668 20070810
- Main IPC: G01R31/08
- IPC: G01R31/08

Abstract:
A method of detecting faulty via holes of a printed circuit board. The printed circuit board including a number of electric trace segments. The method includes steps of: providing a testing system, the testing system comprising a processor, a storing means and a resistance measuring device, the storing means for storing a function Ymin=fmin(X) wherein X represents a reference resistance associated with a given electric trace segment, Ymin represents a minimum threshold value; measuring a resistance of an electric trace segment of a to-be-tested printed circuit board using the resistance measuring device, a to-be-tested via hole located on the electric trace segment; and judging whether the to-be-tested via hole is a faulty via hole according to the following criteria: if |Xa−X|≧Ymin, the to-be-tested via hole is a faulty via hole, and if |Xa−X|
Public/Granted literature
- US20090039895A1 METHOD OF DETECTING FAULTY VIA HOLES IN PRINTED CIRCUIT BOARDS Public/Granted day:2009-02-12
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