Air loaded stripline assemblies and methods for providing same are disclosed. The air loaded stripline assembly includes circuit board layers interconnected to one another. A layer containing a conductive trace forming a stripline is connected to spacer layers. The spacer layers include voids or relieved areas, that define cavities adjacent areas of the stripline layer on which the stripline is formed. Ground plane layers are interconnected to the spacer layers, bounding the cavities. The air loaded stripline assembly can additionally incorporate conductive vias for electrically interconnecting the stripline to other components or assemblies. The air loaded stripline assembly can be formed using conventional printed circuit board techniques.