Invention Grant
- Patent Title: Planer antenna structure
- Patent Title (中): 刨床天线结构
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Application No.: US12323829Application Date: 2008-11-26
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Publication No.: US08049676B2Publication Date: 2011-11-01
- Inventor: Seunghwan Yoon , Franco De Flaviis , Ahmadreza (Reza) Rofougaran
- Applicant: Seunghwan Yoon , Franco De Flaviis , Ahmadreza (Reza) Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick Harrison & Markison
- Main IPC: H01Q1/36
- IPC: H01Q1/36
Abstract:
A planer antenna structure includes a first planer antenna and a second planer antenna. The first planer antenna has a first axial orientation and a conductive antenna pattern on a first surface of a supporting substrate. The second planer antenna has a second axial orientation and the conductive antenna pattern on the first surface of the supporting substrate.
Public/Granted literature
- US20090073054A1 PLANER ANTENNA STRUCTURE Public/Granted day:2009-03-19
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