A solid state image pickup device includes: a semiconductor substrate; a well formed in a surface layer of the semiconductor substrate; a light reception region formed in the well and including a plurality of charge accumulation regions formed in a matrix shape and a plurality of vertical CCDs formed along each column of the charge accumulation regions; a horizontal CCD formed in the well and coupled to ends of the vertical CCDs; a peripheral circuit formed in the well in partial regions of the light reception region and the horizontal CCD; a shield layer formed on the semiconductor substrate including a partial area above the peripheral circuit, made of conductive material and surrounding the light reception region, the shield layer being electrically connected to the semiconductor substrate; a support disposed above the shield layer and made of conductive material; and a translucent member placed on the support.