Invention Grant
- Patent Title: Microcapsule patterning method
- Patent Title (中): 微胶囊图案化方法
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Application No.: US12377563Application Date: 2007-09-18
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Publication No.: US08049953B2Publication Date: 2011-11-01
- Inventor: Chul Am Kim , Seung Youl Kang , Hey Jin Myoung , Kyung Soo Suh , Seong Deok Ahn , Gi Heon Kim , In Kyu You , Ji Young Oh
- Applicant: Chul Am Kim , Seung Youl Kang , Hey Jin Myoung , Kyung Soo Suh , Seong Deok Ahn , Gi Heon Kim , In Kyu You , Ji Young Oh
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2006-0094249 20060927
- International Application: PCT/KR2007/004517 WO 20070918
- International Announcement: WO2008/038928 WO 20080403
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G03G17/04

Abstract:
Provided is a microcapsule patterning method for patterning electrophoretic microcapsules on a substrate, the method including the steps of: preparing a microcapsule slurry in which microcapsules and a water-soluble binder are mixed; putting the microcapsule slurry into a liquid ejector having injection and ejection ports formed therein; and applying the microcapsule slurry contained in the liquid ejector onto the substrate so as to pattern pixels using the microcapsules. Accordingly, specific patterns are formed without physical and chemical damage to the microcapsules. Therefore, the patterns can be used as pixels of flat panel displays. Further, through the patterning, it is possible to implement a color display device which does not exhibit performance degradation.
Public/Granted literature
- US20100225994A1 MICROCAPSULE PATTERNING METHOD Public/Granted day:2010-09-09
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