Invention Grant
- Patent Title: Relay device
- Patent Title (中): 继电器
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Application No.: US12540697Application Date: 2009-08-13
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Publication No.: US08050008B2Publication Date: 2011-11-01
- Inventor: Hirohisa Suzuki
- Applicant: Hirohisa Suzuki
- Applicant Address: JP Anjo
- Assignee: Anden Co., Ltd.
- Current Assignee: Anden Co., Ltd.
- Current Assignee Address: JP Anjo
- Agency: Nixon & Vanderhye PC
- Priority: JP2008-211731 20080820
- Main IPC: H01H47/26
- IPC: H01H47/26

Abstract:
A relay device includes mechanical relays, a first bus bar, a second bus bar, and a relay drive circuit. The relay includes a coil, a moving contact whose position changes according to whether the coil is energized, a load terminal conductive to the contact and connected to the first bar, and a coil terminal connected to the coil and second bar. The first bar includes a loading circuit. A current flows to an external load through the loading circuit opened/closed when the position of the contact changes. The second bar includes a coil circuit through which the coil is energized. The drive circuit is packaged on the second bar and opens/closes the coil circuit based on an operation signal. The first and second bars are stacked at predetermined intervals. The relays are between the first and second bars.
Public/Granted literature
- US20100046133A1 RELAY DEVICE Public/Granted day:2010-02-25
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