A heat receiver includes a casing defining a flow passage on a thermal conductive plate. The thermal conductive plate is received on an electronic component. An outflow nozzle has an inflow opening at the downstream end of the flow passage at a position outside the thermal conductive plate. Since the thermal conductive plate is received on the electronic component, the outflow nozzle is connected to the flow passage at a position outside the electronic component. This results in avoidance of increase in the thickness of the casing as compared with the case where the outflow nozzle directly extends into the flow passage on the thermal conductive plate.