Invention Grant
US08050040B2 Flexible printed circuit board with improved reinforcing structure
有权
柔性印刷电路板,具有改进的增强结构
- Patent Title: Flexible printed circuit board with improved reinforcing structure
- Patent Title (中): 柔性印刷电路板,具有改进的增强结构
-
Application No.: US11078226Application Date: 2005-03-09
-
Publication No.: US08050040B2Publication Date: 2011-11-01
- Inventor: Che-Hung Huang , Cheng-Fu Chang
- Applicant: Che-Hung Huang , Cheng-Fu Chang
- Applicant Address: TW Taoyuan County
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan County
- Agency: J.C. Patents
- Priority: TW94200021U 20050103
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A flexible printed circuit (FPC) board includes a flexible substrate, an electric terminal portion, and a reinforcing structure. The electric terminal portion is disposed on a bottom surface of the flexible substrate and is suitable to be inserted into an electrical connector to electrically connect therewith. The reinforcing structure is disposed on a top surface of the flexible substrate and located just above the electric terminal portion. The reinforcing portion includes a stiffener plate bonded to the top surface of the flexible substrate and a pad bonded to a top surface of the stiffener plate. The pad is shorter than the stiffener plate.
Public/Granted literature
- US20060148312A1 Flexible printed circuit board with improved reinforcing structure Public/Granted day:2006-07-06
Information query