Invention Grant
- Patent Title: Lead frame with solder flow control
- Patent Title (中): 引脚框架采用焊锡流量控制
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Application No.: US12053622Application Date: 2008-03-24
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Publication No.: US08050048B2Publication Date: 2011-11-01
- Inventor: Xuesong Xu , Meijiang Song , Jinzhong Yao
- Applicant: Xuesong Xu , Meijiang Song , Jinzhong Yao
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Priority: CN200710101144 20070429
- Main IPC: H02B1/56
- IPC: H02B1/56 ; H01R43/00 ; H01L23/48 ; H01L23/52 ; H05K5/02
Abstract:
A lead frame has multiple regions having different wetting characteristics on its surface. For example, one region is formed to handle silver plating while another has less wetting ability. A boundary between the regions causes a wetting force difference that inhibits molten solder flow between regions during solder die bonding.
Public/Granted literature
- US20080266828A1 LEAD FRAME WITH SOLDER FLOW CONTROL Public/Granted day:2008-10-30
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