Invention Grant
- Patent Title: Electronic apparatus
- Patent Title (中): 电子仪器
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Application No.: US12355125Application Date: 2009-01-16
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Publication No.: US08050055B2Publication Date: 2011-11-01
- Inventor: Tomoko Monda , Minoru Mukai
- Applicant: Tomoko Monda , Minoru Mukai
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JPP2008-006867 20080116
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
According to one aspect of the invention, there is provided an electronic apparatus having a circuit board supporting structure, the circuit board supporting structure including: a casing including a first body and a second body, the first body having a first boss portion, the second body having a second boss portion; a jig including a cylindrical portion having, and a flange portion formed on an outer periphery, the cylindrical portion configured to slidably receive the first boss portion and the second boss portion in an inner peripheral wall; and a circuit board disposed in the casing. The first and second boss portions are configured to be fastened by a bolt member; the circuit board has a hole and a joining region provided around the hole, the hole configured to allow the cylindrical portion to penetrate therethrough; and the joining region is configured to be soldered to the flange portion.
Public/Granted literature
- US20090190317A1 ELECTRONIC APPARATUS Public/Granted day:2009-07-30
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