A mounting apparatus for electronic components is provided. The mounting apparatus includes a mounting frame including a support portion, backing portion, and lip portion. The backing portion is coupled to a support portion rear end and includes a first segment and a second segment, wherein the second segment is oriented perpendicular to the support portion and the first portion. The lip portion is coupled to a support portion front end such that the support portion and the lip portion define a plurality of slots extending therethrough. The mounting apparatus also includes a plurality of tee bolts each including a first portion and a second portion extending perpendicularly through the first portion, wherein the first portion is removably inserted into a slot. The mounting apparatus also includes a plurality of locating pins that are inserted into a threaded hole extending through the backing portion second segment.