Invention Grant
- Patent Title: Microphone and microphone mounting structure
- Patent Title (中): 麦克风和麦克风安装结构
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Application No.: US11982501Application Date: 2007-11-01
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Publication No.: US08050443B2Publication Date: 2011-11-01
- Inventor: Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Kiyoshi Ota , Tsuyoshi Baba
- Applicant: Toshiro Izuchi , Kazuo Ono , Kensuke Nakanishi , Kiyoshi Ota , Tsuyoshi Baba
- Applicant Address: JP Osaka
- Assignee: Hosiden Corporation
- Current Assignee: Hosiden Corporation
- Current Assignee Address: JP Osaka
- Agent David N. Lathrop
- Priority: JP2006-305101 20061110
- Main IPC: H04R9/08
- IPC: H04R9/08 ; H04R11/04 ; H04R17/02 ; H04R19/04 ; H04R25/00

Abstract:
A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.
Public/Granted literature
- US20080112585A1 Microphone and microphone mounting structurre Public/Granted day:2008-05-15
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