Invention Grant
US08050444B2 Adjustable mechanism for improving headset comfort 失效
可调节机制,提高耳机的舒适度

  • Patent Title: Adjustable mechanism for improving headset comfort
  • Patent Title (中): 可调节机制,提高耳机的舒适度
  • Application No.: US11625238
    Application Date: 2007-01-19
  • Publication No.: US08050444B2
    Publication Date: 2011-11-01
  • Inventor: Dale Trenton Smith
  • Applicant: Dale Trenton Smith
  • Agent Douglas L. Weller
  • Main IPC: H04R25/00
  • IPC: H04R25/00
Adjustable mechanism for improving headset comfort
Abstract:
A headphone, headset, or ear protector incorporating adjustable clamping pressure and providing configurable distribution of headband pressure. In one embodiment, the headphones, headsets, or ear protectors include a headband or neckband and at least one earcup coupled to the headband or neckband. The headphone, headset, or ear protector further includes an adjustment mechanism coupled to the headband or neckband and the at least one earcup that provides continuously variable adjustment of clamping pressure provided by the at least one earcup to the head of a user. In another embodiment, the headphone, headset, or ear protector include a headband or neckband, a first earcup coupled to the headband or neckband and a second earcup coupled to the headband or neckband. The headphone, headset, or ear protector further include an adjustment mechanism coupled to the headband or neckband and the first and second earcups that adjusts clamping pressure provided by the first and second earcups to the head of a user and a single control configured to control the adjustment mechanism. In other embodiments, the headphone, headset, or ear protector allows a user to maintain correct left/right stereo imaging while allowing the user to choose which side is placed over the right or left ear.
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