Invention Grant
- Patent Title: Lens module and assembly method thereof
- Patent Title (中): 镜头模块及其装配方法
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Application No.: US12763130Application Date: 2010-04-19
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Publication No.: US08050553B2Publication Date: 2011-11-01
- Inventor: Chi-Wei Chiu , Ssu-Han Huang
- Applicant: Chi-Wei Chiu , Ssu-Han Huang
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Main IPC: G03B17/00
- IPC: G03B17/00

Abstract:
A lens module includes a flexible printed circuit board, a first sensor, a second sensor, an adjustment device, a lens, a protective frame, an outer housing, a drive mechanism and a resilient member. The flexible printed circuit board includes a first mounting portion and a second mounting portion. The first sensor and the second sensor are fixed on the flexible printed circuit board. The outer housing is connected to the flexible printed circuit board and covers on the outside of the adjustment device and the protective frame. The resilient member and the flexible printed circuit board are arranged on opposite sides of the outer housing. The flexible printed circuit board can be folded along a connecting line between the first mounting portion and the second mounting portion.
Public/Granted literature
- US20110150462A1 LENS MODULE AND ASSEMBLY METHOD THEREOF Public/Granted day:2011-06-23
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