Invention Grant
US08050900B2 System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
有权
用于使用第一原理模拟的系统和方法来提供便于半导体制造过程的虚拟传感器
- Patent Title: System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
- Patent Title (中): 用于使用第一原理模拟的系统和方法来提供便于半导体制造过程的虚拟传感器
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Application No.: US10673583Application Date: 2003-09-30
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Publication No.: US08050900B2Publication Date: 2011-11-01
- Inventor: Andrej S. Mitrovic , Eric J. Strang
- Applicant: Andrej S. Mitrovic , Eric J. Strang
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00 ; G06G7/48 ; H01L21/00
Abstract:
A method, system, and computer readable medium for facilitating a process performed by a semiconductor processing tool. The method includes inputting data relating to a process performed by the semiconductor processing tool, and inputting a first principles physical model relating to the semiconductor processing tool. First principles simulation is performed using the input data and the physical model to provide a virtual sensor measurement relating to the process performed by the semiconductor processing tool, and the virtual sensor measurement is used to facilitate the process performed by the semiconductor processing tool.
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