Invention Grant
US08051391B2 Method for layout of random via arrays in the presence of strong pitch restrictions
有权
在存在强音调限制的情况下随机通道阵列的布局方法
- Patent Title: Method for layout of random via arrays in the presence of strong pitch restrictions
- Patent Title (中): 在存在强音调限制的情况下随机通道阵列的布局方法
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Application No.: US12185248Application Date: 2008-08-04
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Publication No.: US08051391B2Publication Date: 2011-11-01
- Inventor: James Walter Blatchford
- Applicant: James Walter Blatchford
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G21K5/00

Abstract:
Exemplary embodiments provide a method for laying out an integrated circuit (“IC”) design and the IC design layout. In one embodiment, the IC design layout can include a first feature placed on a first intersecting point of a grid. The placed first feature can define a local grid area. The local grid area can further include a plurality of local intersecting points having an outer perimeter spaced from any outermost local intersecting point in a spacing ranging from a length of a grid side to a length of a grid diagonal of a grid unit. A second feature can either be restrictively placed on any local intersecting point of the local grid area, or be randomly placed on any location outside the outer perimeter of the local grid area.
Public/Granted literature
- US20100031216A1 METHOD FOR LAYOUT OF RANDOM VIA ARRAYS IN THE PRESENCE OF STRONG PITCH RESTRICTIONS Public/Granted day:2010-02-04
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