Invention Grant
- Patent Title: Yield evaluating apparatus and method thereof
- Patent Title (中): 产量评价装置及其方法
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Application No.: US12264227Application Date: 2008-11-03
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Publication No.: US08051394B2Publication Date: 2011-11-01
- Inventor: Pei-Wen Luo , Jwu-E Chen , Chin-Long Wey , Liang-Chia Cheng , Ji-Jan Chen , Wen-Ching Wu
- Applicant: Pei-Wen Luo , Jwu-E Chen , Chin-Long Wey , Liang-Chia Cheng , Ji-Jan Chen , Wen-Ching Wu
- Applicant Address: TW Hsinchu TW Taoyuan
- Assignee: Industrial Technology Research Institute,National Central University
- Current Assignee: Industrial Technology Research Institute,National Central University
- Current Assignee Address: TW Hsinchu TW Taoyuan
- Agency: Jianq Chyun IP Office
- Priority: TW97138267A 20081003
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F9/455 ; G06F11/22
Abstract:
A yield evaluating apparatus and a method thereof are provided. The yield evaluating apparatus includes a spatial correlation module. The spatial correlation module receives at least one process-related data and a plurality of circuit layouts and obtains a correlation coefficient between unit elements in the circuit layouts according to the process-related data. The spatial correlation module calculates a spatial correlation between elements in each of the circuit layouts according to the correlation coefficient and selects one of the circuit layouts according to the spatial correlations.
Public/Granted literature
- US20100088655A1 YIELD EVALUATING APPARATUS AND METHOD THEREOF Public/Granted day:2010-04-08
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