Invention Grant
US08051770B2 Robot binding apparatus for coil packaging 有权
用于线圈包装的机器人装订装置

  • Patent Title: Robot binding apparatus for coil packaging
  • Patent Title (中): 用于线圈包装的机器人装订装置
  • Application No.: US12351499
    Application Date: 2009-01-09
  • Publication No.: US08051770B2
    Publication Date: 2011-11-08
  • Inventor: Seung Yong Song
  • Applicant: Seung Yong Song
  • Applicant Address: KR Pohang
  • Assignee: Posco M-Tech
  • Current Assignee: Posco M-Tech
  • Current Assignee Address: KR Pohang
  • Agency: Occhiuti Rohlicek & Tsao LLP
  • Priority: KR10-2008-0054494 20080611; KR10-2008-0096469 20081001; KR10-2008-0131270 20081222; KR10-2008-0131271 20081222
  • Main IPC: B65B13/04
  • IPC: B65B13/04 B65B27/06
Robot binding apparatus for coil packaging
Abstract:
A robot binding apparatus for coil packaging includes: a grip unit that grips a band used for packaging a coil; a grip robot that supports the grip unit, rotates the grip unit seizing the band at the periphery of the coil to make the band wound on the coil, and moves the band to a fastening position; a head unit that provides the band to the grip unit and fastens the band at the band fastening position; and a head robot that supports the head unit and moves the head unit to the band fastening position.
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