Invention Grant
- Patent Title: Case assembly structure of electronic device
- Patent Title (中): 电子设备壳体组装结构
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Application No.: US12046688Application Date: 2008-03-12
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Publication No.: US08052001B2Publication Date: 2011-11-08
- Inventor: Chun-Chen Chen , Li-Yen Chang
- Applicant: Chun-Chen Chen , Li-Yen Chang
- Applicant Address: TW Taoyuan Hsien
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW Taoyuan Hsien
- Agency: Kirton & McConkie
- Agent Evan R. Witt
- Priority: TW96116704A 20070510; TW96141926A 20071106
- Main IPC: B65D43/08
- IPC: B65D43/08 ; B65D43/06

Abstract:
The present invention relates to a case assembly structure. The case assembly structure includes a first case and a second case. The first case has a first connection portion including a first protrusion, a first trench and a second protrusion from an external side to an internal side thereof. The second case has a second connection portion including a third protrusion and a second trench from an external side to an internal side thereof. The first trench and the second protrusion of the first connection portion of the first case are corresponding to the third protrusion and the second trench of the second connection portion of the second case, and an inner wall of the first protrusion of the first connection portion of the first case is in contact with the external side of the second connection portion of the second case such that the first case and the second case are combined together.
Public/Granted literature
- US20080278892A1 CASE ASSEMBLY STRUCTURE OF ELECTRONIC DEVICE Public/Granted day:2008-11-13
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