Invention Grant
- Patent Title: Packages, biochip kits and methods of packaging
- Patent Title (中): 包装，生物芯片套件和包装方法
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Application No.: US12217169Application Date: 2008-07-02
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Publication No.: US08052941B2Publication Date: 2011-11-08
- Inventor: June-Young Lee , Dong-Ho Lee
- Applicant: June-Young Lee , Dong-Ho Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2007-0070875 20070713
- Main IPC: G01N21/75
- IPC: G01N21/75 ; C12M1/34 ; B65B7/00
Abstract:
A package having an improved yield is provided. The package includes a support on which a plurality of biochips are disposed, and a cover bonded to the support and defining a reaction space for each of the plurality of biochips together with the support, the cover including at least one inlet/outlet.
Public/Granted literature
- US20090018035A1 Packages, biochip kits and methods of packaging Public/Granted day:2009-01-15
Information query
