Invention Grant
- Patent Title: Conductive paste and wiring board using same
- Patent Title (中): 导电膏和使用其的接线板
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Application No.: US11887844Application Date: 2007-01-18
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Publication No.: US08053066B2Publication Date: 2011-11-08
- Inventor: Masahiro Yamakawa , Kenji Miyazaki
- Applicant: Masahiro Yamakawa , Kenji Miyazaki
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-012687 20060120
- International Application: PCT/JP2007/050716 WO 20070118
- International Announcement: WO2007/083710 WO 20070726
- Main IPC: B32B7/02
- IPC: B32B7/02
Abstract:
A conductive paste contains metal powder, an inorganic binder, and an organic vehicle as main ingredients. The organic vehicle includes a solvent having a boiling point of 270° C. or higher, and the proportion of the solvent with respect to the entire solvent included in the organic vehicle is 3 to 100% by weight.
Public/Granted literature
- US20090042001A1 Conductive Paste and Wiring Board Using Same Public/Granted day:2009-02-12
Information query
