Invention Grant
US08053161B2 Resist composition, resin for use in the resist composition, compound for use in the synthesis of the resin, and pattern-forming method using the resist composition
有权
抗蚀剂组合物，用于抗蚀剂组合物的树脂，用于合成树脂的化合物和使用抗蚀剂组合物的图案形成方法
- Patent Title: Resist composition, resin for use in the resist composition, compound for use in the synthesis of the resin, and pattern-forming method using the resist composition
- Patent Title (中): 抗蚀剂组合物，用于抗蚀剂组合物的树脂，用于合成树脂的化合物和使用抗蚀剂组合物的图案形成方法
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Application No.: US11860585Application Date: 2007-09-25
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Publication No.: US08053161B2Publication Date: 2011-11-08
- Inventor: Kenji Wada , Hiroshi Saegusa
- Applicant: Kenji Wada , Hiroshi Saegusa
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-259549 20060925
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/075 ; G03F7/20 ; G03F7/30 ; C08F14/18
Abstract:
A resist composition comprises: (A) a resin capable of increasing its solubility in an alkali developer by action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent, wherein the resin (C) has a degree of molecular weight dispersion of 1.3 or less and a weight average molecular weight of 1.0×104 or less.
Public/Granted literature
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