Invention Grant
- Patent Title: Method for manufacturing nitride semiconductor laser element
- Patent Title (中): 氮化物半导体激光元件的制造方法
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Application No.: US12431393Application Date: 2009-04-28
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Publication No.: US08053262B2Publication Date: 2011-11-08
- Inventor: Shingo Tanisaka
- Applicant: Shingo Tanisaka
- Applicant Address: JP Anan-shi
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2008-120446 20080502; JP2008-236026 20080916
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for manufacturing a nitride semiconductor laser element having a nitride semiconductor layer including at least an active layer provided on a substrate, a pair of cavity planes formed on the nitride semiconductor layer, and a protruding part where part of the substrate protrudes from said cavity plane, said method comprises: a step of forming the nitride semiconductor layer on the substrate; a first etching step of forming a first groove by etching at least the nitride semiconductor layer; and a second etching step of forming the cavity plane, in the second etching step, the inner wall of the first groove and part of the nitride semiconductor layer surface adjacent to the first groove are etched to form a second groove, and form the upper face of the protruding part.
Public/Granted literature
- US20090275159A1 METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LASER ELEMENT Public/Granted day:2009-11-05
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