Invention Grant
- Patent Title: Thermally enhanced single inline package (SIP)
- Patent Title (中): 热增强型单列直插封装（SIP）
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Application No.: US12565976Application Date: 2009-09-24
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Publication No.: US08053285B2Publication Date: 2011-11-08
- Inventor: Chris E Haga , Anthony L Coyle , William D Boyd
- Applicant: Chris E Haga , Anthony L Coyle , William D Boyd
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
In a method and system for fabricating a thermally enhanced semiconductor device (200, 300) is packaged as a through hole single inline package (SIP). A leadframe (210, 310, 410) having a die pad (220, 320, 420) to attach an IC die (230, 330), a first plurality of conductive leads (240, 340, 430) formed from a first portion of metal sheet (432), and a second portion of metal sheet (440) disposed on an opposite side of the IC die (230, 330) as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads (240, 340, 430) are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet (440) includes the die pad (420) to form a heat spreader (260, 360) in the form of the metal sheet. The heat spreader (260, 360) provides heat dissipating for the heat generated by the IC die (230, 330).
Public/Granted literature
- US20100015761A1 Thermally Enhanced Single Inline Package (SIP) Public/Granted day:2010-01-21
Information query
IPC分类:
