Invention Grant
- Patent Title: SOI body contact using E-DRAM technology
- Patent Title (中): SOI体接触采用E-DRAM技术
-
Application No.: US13075552Application Date: 2011-03-30
-
Publication No.: US08053303B2Publication Date: 2011-11-08
- Inventor: John E. Barth, Jr. , Kerry Bernstein , Francis R. White
- Applicant: John E. Barth, Jr. , Kerry Bernstein , Francis R. White
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L21/8238
- IPC: H01L21/8238

Abstract:
A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a body contact disposed under the body/channel region and in the insulator layer. The body contact electrically connects with and contacts with the body/channel region of the semiconductor device and the substrate, to thereby form an ohmic contact and to eliminate floating body effects.
Public/Granted literature
- US20110177659A1 SOI BODY CONTACT USING E-DRAM TECHNOLOGY Public/Granted day:2011-07-21
Information query
IPC分类: