Invention Grant
- Patent Title: Method of forming a high voltage device
- Patent Title (中): 形成高压器件的方法
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Application No.: US12390509Application Date: 2009-02-23
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Publication No.: US08053319B2Publication Date: 2011-11-08
- Inventor: Junwen Liu , Purakh Raj Verma , Yan Jin , Baofu Zhu
- Applicant: Junwen Liu , Purakh Raj Verma , Yan Jin , Baofu Zhu
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Horizon IP Pte Ltd
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method of forming a device is presented. A substrate prepared with an active device region is provided. The active device region includes gate stack layers of a gate stack that includes at least a gate electrode layer over a gate dielectric layer. An implant mask is formed on the substrate with an opening exposing a portion of a top gate stack layers. Ions are implanted through the opening and gate stack layers into the substrate to form a channel well. The substrate is patterned to at least remove portion of a top gate stack layer unprotected by the implant mask.
Public/Granted literature
- US20100213544A1 HIGH VOLTAGE DEVICE Public/Granted day:2010-08-26
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