Invention Grant
- Patent Title: Method of forming at least one bonding structure
- Patent Title (中): 形成至少一个结合结构的方法
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Application No.: US12903714Application Date: 2010-10-13
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Publication No.: US08053351B2Publication Date: 2011-11-08
- Inventor: Hwang-Bok Ryu , Ky-Hyun Jung , Jae-Yong Park , Ho-Geon Song
- Applicant: Hwang-Bok Ryu , Ky-Hyun Jung , Jae-Yong Park , Ho-Geon Song
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0119223 20091203
- Main IPC: H01L21/60
- IPC: H01L21/60
Abstract:
A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad.
Public/Granted literature
- US20110136334A1 METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE Public/Granted day:2011-06-09
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