Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes

Invention Grant

US08053352B2 Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes 有权

Title translation: 用于通过铜溅射实现Z轴串扰减少的网格参考平面的方法和网格参考结构

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Patent Title: Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes
Patent Title (中): 用于通过铜溅射实现Z轴串扰减少的网格参考平面的方法和网格参考结构
Application No.: US11250043

Application Date: 2005-10-13
Publication No.: US08053352B2

Publication Date: 2011-11-08
Inventor: Roger Allen Booth, Jr. , Matthew Stephen Doyle
Applicant: Roger Allen Booth, Jr. , Matthew Stephen Doyle
Applicant Address: US NY Armonk
Assignee: International Business Machines Corporation
Current Assignee: International Business Machines Corporation
Current Assignee Address: US NY Armonk
Agent Joan Pennington
Main IPC: H01L21/4763
IPC: H01L21/4763

Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes

Abstract:

A method and mesh reference applications are provided for implementing Z-axis cross-talk reduction. A mesh reference plane including a grid of mesh traces is formed with the mesh traces having selected thickness and width dimensions effective for reference current-flow distribution. An electrically conductive coating is deposited to fill the mesh electrical holes in the mesh reference plane to reduce cross-talk, substantially without affecting mechanical flexibility.

Abstract(Chinese):

提供了一种实现Z轴串扰降低的方法和网格参考应用。包括网格轨迹的网格的网格参考平面形成为具有选定的厚度和宽度尺寸的网格轨迹对于参考电流分布有效。沉积导电涂层以填充网格参考平面中的网格电孔，以减少串扰，基本上不影响机械灵活性。

Public/Granted literature

US20070087556A1 Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes Public/Granted day:2007-04-19

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46	....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割
H01L21/4763	......非绝缘层的沉积，例如绝缘层上的导电层、电阻层；这些层的后处理（电极的制造入H01L21/28）