Invention Grant
US08053377B2 Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same
有权
具有海绵状结构的低应力光敏树脂和使用其制造的装置
- Patent Title: Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same
- Patent Title (中): 具有海绵状结构的低应力光敏树脂和使用其制造的装置
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Application No.: US12892190Application Date: 2010-09-28
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Publication No.: US08053377B2Publication Date: 2011-11-08
- Inventor: Shang-Ying Tsai , Chun-Ren Cheng , Jiou-Kang Lee , Jung-Huei Peng , Ting-Hau Wu
- Applicant: Shang-Ying Tsai , Chun-Ren Cheng , Jiou-Kang Lee , Jung-Huei Peng , Ting-Hau Wu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469
Abstract:
System and method for forming a structure including a MEMS device structure. In order to prevent warpage of a substrate arising from curing process for a sacrificial material (such as a photoresist), and from subsequent high temperature process steps, an improved sacrificial material comprises (i) a polymer and (ii) a foaming agent or special function group. The structure can be formed by forming a trench in a substrate and filling the trench with a sacrificial material. The sacrificial material includes (i) a polymer and (ii) a foaming agent or special function group. After further process steps are completed, the sacrificial material is removed from the trench.
Public/Granted literature
- US20110081740A1 Low Stress Photo-Sensitive Resin with Sponge-Like Structure and Devices Manufactured Employing Same Public/Granted day:2011-04-07
Information query
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