Invention Grant
US08053507B2 Highly filled elastomeric resin compositions with added microsilica for processability 有权
高填充弹性体树脂组合物,加入微硅粉

  • Patent Title: Highly filled elastomeric resin compositions with added microsilica for processability
  • Patent Title (中): 高填充弹性体树脂组合物,加入微硅粉
  • Application No.: US10517126
    Application Date: 2003-05-22
  • Publication No.: US08053507B2
    Publication Date: 2011-11-08
  • Inventor: Gerd Schmaucks
  • Applicant: Gerd Schmaucks
  • Applicant Address: NO Oslo
  • Assignee: Elkem AS
  • Current Assignee: Elkem AS
  • Current Assignee Address: NO Oslo
  • Agency: Lucas & Mercanti, LLP
  • Priority: NO20022708 20020607
  • International Application: PCT/NO03/00166 WO 20030522
  • International Announcement: WO03/104317 WO 20031218
  • Main IPC: C01B33/113
  • IPC: C01B33/113 C01B33/18 C08K3/36 C08K3/00
Highly filled elastomeric resin compositions with added microsilica for processability
Abstract:
The present invention relates to elastomeric compounds having a high filler content additionally containing 1 to 400% by weight of resin of microsilica as a modifier to improve the processability. Thereafter, the invention relates to a method for production of elastomeric compounds having a high filler content, wherein microsilica is added to the elastomeric compounds in an amount of 1 to 400% by weight of resin as a modifier to improve processability.
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