Invention Grant
- Patent Title: Housing of quad small form-factor pluggable transceiver module
- Patent Title (中): 四通小型可插拔收发模块的外壳
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Application No.: US12178237Application Date: 2008-07-23
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Publication No.: US08053667B2Publication Date: 2011-11-08
- Inventor: Chun-Hua Chen , Chun-Hsu Chen
- Applicant: Chun-Hua Chen , Chun-Hsu Chen
- Applicant Address: TW Chung Ho
- Assignee: Jess-Link Products Co., Ltd.
- Current Assignee: Jess-Link Products Co., Ltd.
- Current Assignee Address: TW Chung Ho
- Agency: Nikolai & Mersereau, P.A.
- Agent C. G. Mersereau
- Main IPC: H02G3/08
- IPC: H02G3/08

Abstract:
A housing of a Quad Small Form-Factor Pluggable transceiver module includes a metallic casing and a plurality of elastic grounding assemblies. The metallic casing has a lower casing, a plurality of partitions and an upper casing. The lower casing is connected to the upper casing. The partitions are provided between the lower casing and the upper casing at intervals, thereby separating the interior of the metallic casing into a plurality of accommodating spaces. The accommodating spaces each receives a connector of a transceiver module, thereby forming a plurality of ports. Thus, the connectors of the transceiver modules share the common housing, thereby reducing the occupied space on the circuit board and increasing the number of the transceiver modules arranged on the circuit board.
Public/Granted literature
- US20100018738A1 HOUSING OF QUAD SMALL FORM-FACTOR PLUGGABLE TRANSCEIVER MODULE Public/Granted day:2010-01-28
Information query
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