Invention Grant
- Patent Title: Interconnection, electronic device and method for manufacturing an electronic device
- Patent Title (中): 互连，电子设备和制造电子设备的方法
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Application No.: US12062112Application Date: 2008-04-03
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Publication No.: US08053678B2Publication Date: 2011-11-08
- Inventor: Tadashi Sakai , Naoshi Sakuma , Masayuki Katagiri , Tomio Ono , Mariko Suzuki
- Applicant: Tadashi Sakai , Naoshi Sakuma , Masayuki Katagiri , Tomio Ono , Mariko Suzuki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Tohshiba
- Current Assignee: Kabushiki Kaisha Tohshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPP2007-099542 20070405
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
An interconnection includes a bundle of conductive members, each of the conductive members being made of carbon nanotube having an end connected to a first conductive film, and another end connected to a second conductive film separated from the first conductive film; and carbon particles each having a diamond crystal structure, dispersed between the conductive members.
Public/Granted literature
- US20080245553A1 INTERCONNECTION, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE Public/Granted day:2008-10-09
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