Invention Grant
US08053684B2 Mounting structure and method for mounting electronic component onto circuit board
失效
将电子元件安装到电路板上的安装结构和方法
- Patent Title: Mounting structure and method for mounting electronic component onto circuit board
- Patent Title (中): 将电子元件安装到电路板上的安装结构和方法
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Application No.: US12158904Application Date: 2006-12-19
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Publication No.: US08053684B2Publication Date: 2011-11-08
- Inventor: Shigemasa Takahashi , Takashi Yamada , Shinji Mizuno , Masahiro Kitahara , Daisuke Makino
- Applicant: Shigemasa Takahashi , Takashi Yamada , Shinji Mizuno , Masahiro Kitahara , Daisuke Makino
- Applicant Address: JP
- Assignee: Teikoku Tsushin Kogyo Co., Ltd.
- Current Assignee: Teikoku Tsushin Kogyo Co., Ltd.
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2005-371183 20051223; JP2006-104285 20060405
- International Application: PCT/JP2006/325252 WO 20061219
- International Announcement: WO2007/072812 WO 20070628
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.
Public/Granted literature
- US20090277684A1 MOUNTING STRUCTURE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT ONTO CIRCUIT BOARD Public/Granted day:2009-11-12
Information query
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