Invention Grant
- Patent Title: Laser assisted machining process with distributed lasers
- Patent Title (中): 激光辅助加工加工分布式激光器
-
Application No.: US11517543Application Date: 2006-09-07
-
Publication No.: US08053705B2Publication Date: 2011-11-08
- Inventor: Yung C. Shin
- Applicant: Yung C. Shin
- Applicant Address: US IN West Lafayette
- Assignee: Purdue Research Foundation
- Current Assignee: Purdue Research Foundation
- Current Assignee Address: US IN West Lafayette
- Agent William F. Bahret
- Main IPC: B23K26/00
- IPC: B23K26/00
Abstract:
Laser assisted machining process and machine utilizing multiple distributed laser units that are strategically distributed around the workpiece being machined to simultaneously heat the workpiece, creating a desired temperature distribution for laser assisted machining. Sequential incremental heating from different directions and positions are used, resulting in longer tool life and shorter machining time.
Public/Granted literature
- US20070062920A1 Laser assisted machining process with distributed lasers Public/Granted day:2007-03-22
Information query
