Invention Grant
- Patent Title: Nitride semiconductor light emitting element
- Patent Title (中): 氮化物半导体发光元件
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Application No.: US12227694Application Date: 2006-05-26
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Publication No.: US08053756B2Publication Date: 2011-11-08
- Inventor: Ken Nakahara , Norikazu Ito , Kazuaki Tsutsumi
- Applicant: Ken Nakahara , Norikazu Ito , Kazuaki Tsutsumi
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- International Application: PCT/JP2006/310551 WO 20060526
- International Announcement: WO2007/138658 WO 20071206
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/00

Abstract:
Provided is a nitride semiconductor light emitting element having an improved carrier injection efficiency from a p-type nitride semiconductor layer to an active layer by simple means from a viewpoint utterly different from the prior art. A buffer layer 2, an undoped GaN layer 3, an n-type GaN contact layer 4, an InGaN/GaN superlattice layer 5, an active layer 6, a first undoped InGaN layer 7, a second undoped InGaN layer 8, and a p-type Gan-based contact layer 9 are stacked on a sapphire substrate 1. A p-electrode 10 is formed on the p-type Gan-based contact layer 9. An n-electrode 11 is formed on a surface where the n-type GaN contact layer 4 is exposed as a result of mesa-etching. The first undoped InGaN layer 7 is formed to contact a well layer closest to a p-side in the active layer having a quantum well structure, and subsequently the second undoped InGaN layer 8 is formed thereon. The carrier injection efficiency into the active layer 6 can be improved by making the total film thickness of the first and second undoped InGaN layers 20 nm or less.
Public/Granted literature
- US20090166607A1 Nitride Semiconductor Light Emitting Element Public/Granted day:2009-07-02
Information query
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