Invention Grant
US08053759B2 Ion implantation for suppression of defects in annealed SiGe layers
有权
用于抑制退火SiGe层缺陷的离子注入
- Patent Title: Ion implantation for suppression of defects in annealed SiGe layers
- Patent Title (中): 用于抑制退火SiGe层缺陷的离子注入
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Application No.: US12539248Application Date: 2009-08-11
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Publication No.: US08053759B2Publication Date: 2011-11-08
- Inventor: Stephen W. Bedell , Huajie Chen , Keith E. Fogel , Devendra K. Sadana , Ghavam G. Shahidi
- Applicant: Stephen W. Bedell , Huajie Chen , Keith E. Fogel , Devendra K. Sadana , Ghavam G. Shahidi
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully Scott Murphy & Presser, PC
- Agent Louis J. Percello, Esq.
- Main IPC: H01L29/30
- IPC: H01L29/30

Abstract:
A substrate material including a Si-containing substrate and an insulating region that is resistant to Ge diffusion present atop the Si-containing substrate. The substrate material further includes a substantially relaxed SiGe alloy layer present atop the insulating region, wherein the substantially relaxed SiGe alloy layer has a planar defect density from about 5000 defects/cm−2 or less. The substrate material may be employed in a heterostructure, in which a strained Si layer is present atop the substantially relaxed SiGe alloy layer of the substrate material.
Public/Granted literature
- US20100032684A1 ION IMPLANTATION FOR SUPPRESSION OF DEFECTS IN ANNEALED SiGe LAYERS Public/Granted day:2010-02-11
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