Invention Grant
- Patent Title: Doping of semiconductor fin devices
- Patent Title (中): 掺杂半导体鳍片器件
-
Application No.: US12732011Application Date: 2010-03-25
-
Publication No.: US08053839B2Publication Date: 2011-11-08
- Inventor: Yee-Chia Yeo , Ping-Wei Wang , Hao-Yu Chen , Fu-Liang Yang , Chenming Hu
- Applicant: Yee-Chia Yeo , Ping-Wei Wang , Hao-Yu Chen , Fu-Liang Yang , Chenming Hu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor structure includes of a plurality of semiconductor fins overlying an insulator layer, a gate dielectric overlying a portion of said semiconductor fin, and a gate electrode overlying the gate dielectric. Each of the semiconductor fins has a top surface, a first sidewall surface, and a second sidewall surface. Dopant ions are implanted at a first angle (e.g., greater than about 7°) with respect to the normal of the top surface of the semiconductor fin to dope the first sidewall surface and the top surface. Further dopant ions are implanted with respect to the normal of the top surface of the semiconductor fin to dope the second sidewall surface and the top surface.
Public/Granted literature
- US20100176424A1 Doping of Semiconductor Fin Devices Public/Granted day:2010-07-15
Information query
IPC分类: