Invention Grant
- Patent Title: Semiconductor device including dummy gate part and method of fabricating the same
- Patent Title (中): 半导体器件包括伪栅极部分及其制造方法
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Application No.: US12291211Application Date: 2008-11-07
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Publication No.: US08053845B2Publication Date: 2011-11-08
- Inventor: Byoung-ho Kwon , Sang-youn Jo , Jin-sook Choi , Chang-ki Hong , Bo-un Yoon , Hong-soo Kim , Se-rah Yun
- Applicant: Byoung-ho Kwon , Sang-youn Jo , Jin-sook Choi , Chang-ki Hong , Bo-un Yoon , Hong-soo Kim , Se-rah Yun
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2007-0113719 20071108
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
In a reliable semiconductor device and a method of fabricating the semiconductor device, a difference in height between upper surfaces of a cell region and a peripheral region (also referred to as a level difference) is minimized by optimizing dummy gate parts. The semiconductor device includes a semiconductor substrate including a cell region and a peripheral region surrounding the cell region, a plurality of dummy active regions surrounded by a device isolating region and formed apart from each other, and a plurality of dummy gate parts formed on the dummy active regions and on the device isolating regions located between the dummy active regions, wherein each of the dummy gate parts covers two or more of the dummy active regions.
Public/Granted literature
- US20090121296A1 Semiconductor device including dummy gate part and method of fabricating the same Public/Granted day:2009-05-14
Information query
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