Invention Grant
US08053890B2 Microchip assembly including an inductor and fabrication method
有权
Microchip组件包括电感和制造方法
- Patent Title: Microchip assembly including an inductor and fabrication method
- Patent Title (中): Microchip组件包括电感和制造方法
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Application No.: US11641604Application Date: 2006-12-19
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Publication No.: US08053890B2Publication Date: 2011-11-08
- Inventor: Giuseppe Li Puma , Dietolf Seippel
- Applicant: Giuseppe Li Puma , Dietolf Seippel
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102006057332 20061205
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
An assembly includes a substrate, a chip mounted on the substrate, a voltage controlled oscillator circuit including an inductor and further circuit elements. The inductor is mounted on or in the substrate, and the further circuit elements are mounted on or in the chip. An assembly is disclosed that includes a substrate including a first metallization plane and a second metallization plane, a chip mounted on the substrate, and an inductor mounted on or in the substrate. The inductor includes a first inductor portion in the first metallization plane and a second inductor portion in the second metallization plane. An assembly is also disclosed including a substrate, a chip mounted onto the substrate, and a transformer formed at least in part on or in the substrate.
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