An electronic component, which is surface-mounted on a wiring board by soldering, and in which the occurrence of cracks in the solder after surface-mounting is suppressed, may include: a member constituting at least part of a container and made of ceramic; and an external terminal provided on the outer surface of the member and used in surface-mounting the electronic component on the wiring board by solder. The film thickness of a layer constituting the external terminal is designed so that when the thermal expansion coefficient of the ceramic constituting the member is α1, combined expansion coefficient αk of the member and the external terminal satisfies a relation of 1.029≦αk/α1≦1.216. The external terminal preferably comprises a nickel layer as an electrode body.