Invention Grant
- Patent Title: Impedance matching methods and systems performing the same
- Patent Title (中): 阻抗匹配方法和系统执行相同
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Application No.: US12072991Application Date: 2008-02-29
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Publication No.: US08053991B2Publication Date: 2011-11-08
- Inventor: Jae-Hyun Kim , Sang-Won Lee , Yong-Gwan Lee
- Applicant: Jae-Hyun Kim , Sang-Won Lee , Yong-Gwan Lee
- Applicant Address: KR Daejeon
- Assignee: Plasmart Co., Ltd.
- Current Assignee: Plasmart Co., Ltd.
- Current Assignee Address: KR Daejeon
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Priority: KR10-2007-0038209 20070419
- Main IPC: H01J7/24
- IPC: H01J7/24

Abstract:
Provided are an impedance matching method and a matching system performing the same. The method includes: measuring an electrical characteristic of the power transmission line including the matching system and the load; extracting a control parameter for impedance matching from the electrical characteristic of the power transmission line; and controlling the matching system by using the control parameter. The extracting of the control parameter comprises utilizing an analytic coordinate system that quantitatively relates the electrical characteristic of the matching system to the electrical characteristic of the power transmission line.
Public/Granted literature
- US20080258836A1 Impedance matching methods and systems performing the same Public/Granted day:2008-10-23
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