An electronic device mounting structure includes an electronic device, a busbar, and a solder. The electronic device has a body and a lead protruding from the body. The busbar has a flat portion and a wall portion rising from a periphery of the flat portion. The flat portion of the busbar extends parallel to a tip portion of the lead and is in contact with a back surface of the tip portion. The wall portion of the busbar faces a side surface of the tip portion with a predetermined space. The solder is located in the space and joins the side surface of the tip portion and the wall portion of the busbar.