Invention Grant
- Patent Title: Three dimensionally stacked non volatile memory units
- Patent Title (中): 三维堆叠的非易失性存储单元
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Application No.: US12425084Application Date: 2009-04-16
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Publication No.: US08054673B2Publication Date: 2011-11-08
- Inventor: Xuguang Wang , Yong Lu , Hai Li , Hongyue Liu
- Applicant: Xuguang Wang , Yong Lu , Hai Li , Hongyue Liu
- Applicant Address: US CA Scotts Valley
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Scotts Valley
- Agency: Campbell Nelson Whipps LLC
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C11/14 ; G11C11/22 ; H01L23/52 ; H01L23/02

Abstract:
A memory unit including a first transistor spanning a first transistor region in a first layer of the memory unit; a second transistor spanning a second transistor region in a second layer of the memory unit; a first resistive sense memory (RSM) cell spanning a first memory region in a third layer of the memory unit; and a second RSM cell spanning a second memory region in the third layer of the memory unit, wherein the first transistor is electrically coupled to the first RSM cell, and the second transistor is electrically coupled to the second RSM cell, wherein the second layer is between the first and third layers, wherein the first and second transistor have an transistor overlap region, and wherein the first memory region and the second memory region do not extend beyond the first transistor region and the second transistor region.
Public/Granted literature
- US20100265749A1 THREE DIMENSIONALLY STACKED NON VOLATILE MEMORY UNITS Public/Granted day:2010-10-21
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