Invention Grant
- Patent Title: Integrated circuit device and electronic instrument
- Patent Title (中): 集成电路器件和电子仪器
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Application No.: US11477670Application Date: 2006-06-30
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Publication No.: US08054710B2Publication Date: 2011-11-08
- Inventor: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
- Applicant: Satoru Ito , Masahiko Moriguchi , Kazuhiro Maekawa , Noboru Itomi , Satoru Kodaira , Junichi Karasawa , Takashi Kumagai , Hisanobu Ishiyama , Takashi Fujise
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-192479 20050630; JP2006-034500 20060210
- Main IPC: G11C8/00
- IPC: G11C8/00

Abstract:
An integrated circuit device includes first to Nth circuit blocks CB1 to CBN, a first interface region disposed along a fourth side and on the D2 side of the first to Nth circuit blocks CB1 to CBN, and a second interface region disposed along a second side and on the D4 side of the first to Nth circuit blocks CB1 to CBN. A local line LLG formed using a wiring layer lower than an Ith layer is provided between the adjacent circuit blocks as at least one of a signal line and a power supply line. Global lines GLG and GLD formed using the Ith or higher wiring layer are provided along the direction D1 over the circuit block disposed between the nonadjacent circuit blocks as at least one of a signal line and a power supply line.
Public/Granted literature
- US20070001982A1 Integrated circuit device and electronic instrument Public/Granted day:2007-01-04
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