Invention Grant
- Patent Title: Substrate stage mechanism and substrate processing apparatus
- Patent Title (中): 基板台机构和基板加工装置
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Application No.: US11995611Application Date: 2006-07-11
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Publication No.: US08055125B2Publication Date: 2011-11-08
- Inventor: Tomohito Komatsu
- Applicant: Tomohito Komatsu
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-205717 20050714
- International Application: PCT/JP2006/313754 WO 20060711
- International Announcement: WO2007/007744 WO 20070118
- Main IPC: F26B19/00
- IPC: F26B19/00

Abstract:
A substrate stage mechanism (10) configured to place a substrate (W) thereon inside a process container of a substrate processing apparatus (100) and having a substrate heating function for heating the substrate (W) includes a substrate table (11) including a base body (11a) configured to place the substrate (W) thereon and a heating element (13) provided to the base body (11a) and configured to heat the substrate (W); a support member (12) having an upper end connected to the substrate table (11) and a lower end attached to the process container; and a heating device (17) configured to heat the support member (12).
Public/Granted literature
- US20090123140A1 SUBSTRATE STAGE MECHANISM AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2009-05-14
Information query
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