Invention Grant
- Patent Title: Circuit board and method for fabricating the same
- Patent Title (中): 电路板及其制造方法
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Application No.: US12188551Application Date: 2008-08-08
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Publication No.: US08058568B2Publication Date: 2011-11-15
- Inventor: Chia-Wei Chang
- Applicant: Chia-Wei Chang
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Schmeiser Olsen & Watts LLP
- Priority: TW96129155A 20070808
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/00 ; H05K1/09
Abstract:
A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wiring layer to be bonded to the core layer better, thereby preventing delamination and forming a fine-pitch wiring layer.
Public/Granted literature
- US20090038838A1 CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME Public/Granted day:2009-02-12
Information query
