Invention Grant
- Patent Title: Transparent solder mask LED assembly
- Patent Title (中): 透明焊接面罩LED组件
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Application No.: US12239516Application Date: 2008-09-26
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Publication No.: US08058664B2Publication Date: 2011-11-15
- Inventor: Wei Shi , Alex Shaikevitch
- Applicant: Wei Shi , Alex Shaikevitch
- Applicant Address: US CA Livermore
- Assignee: Bridgelux, Inc.
- Current Assignee: Bridgelux, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Haynes and Boone, LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00

Abstract:
A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.
Public/Granted literature
- US20100078663A1 TRANSPARENT SOLDER MASK LED ASSEMBLY Public/Granted day:2010-04-01
Information query
IPC分类: