Invention Grant
- Patent Title: Integrated circuit devices with stacked package interposers
- Patent Title (中): 具有堆叠封装内插器的集成电路器件
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Application No.: US12625384Application Date: 2009-11-24
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Publication No.: US08058716B2Publication Date: 2011-11-15
- Inventor: Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
- Applicant: Chew Beng Chye , Tan Kian Shing Michael , Tan Hock Chuan , Neo Chee Peng
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
Public/Granted literature
- US20100065955A1 Integrated Circuit Devices with Stacked Package Interposers Public/Granted day:2010-03-18
Information query
IPC分类:
